| contributor author | S. Szykman | |
| contributor author | J. Cagan | |
| date accessioned | 2017-05-08T23:47:57Z | |
| date available | 2017-05-08T23:47:57Z | |
| date copyright | June, 1995 | |
| date issued | 1995 | |
| identifier issn | 1050-0472 | |
| identifier other | JMDEDB-27627#308_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115731 | |
| description abstract | This paper introduces a simulated annealing-based approach to three-dimensional component packing that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two-dimensional layout of VLSI circuits; this research extends techniques developed for two-dimensional layout optimization to three-dimensional problems which are more representative of mechanical engineering applications. This research also provides a framework in which to solve general component layout problems. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Simulated Annealing-Based Approach to Three-Dimensional Component Packing | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 2A | |
| journal title | Journal of Mechanical Design | |
| identifier doi | 10.1115/1.2826140 | |
| journal fristpage | 308 | |
| journal lastpage | 314 | |
| identifier eissn | 1528-9001 | |
| keywords | Annealing | |
| keywords | Packing (Shipments) | |
| keywords | Simulated annealing | |
| keywords | Mechanical engineering | |
| keywords | Optimization AND Circuits | |
| tree | Journal of Mechanical Design:;1995:;volume( 117 ):;issue: 2A | |
| contenttype | Fulltext | |
