| contributor author | Boris Mirman | |
| date accessioned | 2017-05-08T23:46:52Z | |
| date available | 2017-05-08T23:46:52Z | |
| date copyright | December, 1995 | |
| date issued | 1995 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26151#340_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115121 | |
| description abstract | A new test to measure the adhesion of thin polymeric coatings (the so-called “edge delamination test”) has been recently proposed by Shaffer et al. (1993), where the authors translate the test measurements into the values of the debond energy by finite element modeling. The present paper suggests another interpretation of the mechanics of the edge delamination test and translates the measurements of this test into conventional values of the adhesion strength—the ultimate peeling stress, using a simple closed-form solution. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | The Mechanics of the Edge Delamination Test | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792114 | |
| journal fristpage | 340 | |
| journal lastpage | 343 | |
| identifier eissn | 1043-7398 | |
| keywords | Delamination | |
| keywords | Measurement | |
| keywords | Stress | |
| keywords | Finite element analysis | |
| keywords | Modeling AND Coatings | |
| tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004 | |
| contenttype | Fulltext | |
