On the Possibility of Process Monitoring in Grinding by Spark Intensity Measurements

Abstract

Precision manufacturing processes like grinding are capable of producing parts to high dimensional accuracies and excellent surface finish. Process monitoring is critical in grinding to achieve accuracy, finish and surface integrity. In this paper an attempt has been made to explore the possibility of process monitoring in grinding by spark field measurements. After establishing the correlation between the chip sizes and roughness produced in grinding, a thermal model is presented showing the relationship between chip size, temperature and time. Using a CCD camera and a computer, the spark field in grinding was monitored and analyzed. Results indicate the possibility of monitoring the process by this approach.