| contributor author | Lewis S. Goldmann | |
| date accessioned | 2017-05-08T23:43:58Z | |
| date available | 2017-05-08T23:43:58Z | |
| date copyright | March, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26141#23_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113457 | |
| description abstract | A new method is presented to compute the mechanical compliance and thermal stress in surface mount leads of arbitrary shape. It involves expressing the profile polynomially by a computer-generated spline curve, and numerically integrating the generalized Castigliano formulas. Comparisons to data in the literature, generated by standard analytical and experimental techniques, show excellent agreement. An example is presented to show typical results obtainable by using the model. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Numerical Lead Frame Compliance and Stress Model | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905489 | |
| journal fristpage | 23 | |
| journal lastpage | 29 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress | |
| keywords | Structural frames | |
| keywords | Thermal stresses | |
| keywords | Splines | |
| keywords | Computers | |
| keywords | Formulas | |
| keywords | Shapes AND Surface mount packaging | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001 | |
| contenttype | Fulltext | |
