| contributor author | N. Paydar | |
| contributor author | Y. Tong | |
| contributor author | H. U. Akay | |
| date accessioned | 2017-05-08T23:43:53Z | |
| date available | 2017-05-08T23:43:53Z | |
| date copyright | December, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26146#265_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113414 | |
| description abstract | The elastic-plastic-creep characteristics of solder joints are implemented in a nonlinear finite element program ABAQUS by developing user defined material subroutines. An eutectic Pb-Sn solder joint of a resistor carrier under thermal cycling between 125°C and −55°C is modeled, and the effect of various parameters on the solder joint cycle life is evaluated. The strain range of the solder joint under thermal cycling loads is calculated, which is then converted into solder joint cycle life through a fatigue-life relationship proposed by Engelmaier (1983). The parameters studied include: ramp time, hold time, grain size, initial temperature, constitutive equations, material properties for solder alloys, and mesh refinement. The effects of these variations on the fatigue life of solder joints are illustrated. The described method can serve as a tool in the design and manufacturing of surface-mount (SMT) assemblies. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905697 | |
| journal fristpage | 265 | |
| journal lastpage | 273 | |
| identifier eissn | 1043-7398 | |
| keywords | Finite element analysis | |
| keywords | Fatigue life | |
| keywords | Solder joints | |
| keywords | Cycles | |
| keywords | Grain size | |
| keywords | Resistors | |
| keywords | Surface mount packaging | |
| keywords | Creep | |
| keywords | Temperature | |
| keywords | Alloys | |
| keywords | Solders | |
| keywords | Manufacturing | |
| keywords | Stress | |
| keywords | Materials properties | |
| keywords | Constitutive equations AND Design | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004 | |
| contenttype | Fulltext | |
