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contributor authorY. Mutoh
contributor authorT. Oikawa
contributor authorN. Miyahara
contributor authorK. Yamaishi
date accessioned2017-05-08T23:41:29Z
date available2017-05-08T23:41:29Z
date copyrightJuly, 1993
date issued1993
identifier issn0094-4289
identifier otherJEMTA8-26957#268_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/112014
description abstractFracture Toughness of HIP-sintered silicon nitride decreased with increasing temperature up to 1200°C. The brittle-to-ductile transition was observed in the temperature range from 1200°C to 1275°C: the fracture toughness rapidly increased in the transition region. Above the transition temperature, the fracture toughness decreased with increasing temperature. Fracture toughness of sialon increased with increasing temperature. Transition of fracture mechanism was observed in sialon around 1300°C. The differences of temperature dependence of fracture toughness between two materials are interpreted in terms of the effects of grain-boundary glass phase on fracture.
publisherThe American Society of Mechanical Engineers (ASME)
titleHigh Temperature Fracture Toughness in Silicon Nitride and Sialon
typeJournal Paper
journal volume115
journal issue3
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2904217
journal fristpage268
journal lastpage272
identifier eissn1528-8889
keywordsSilicon nitride ceramics
keywordsFracture toughness
keywordsHigh temperature
keywordsTemperature
keywordsFracture (Process)
keywordsGlass
keywordsBrittleness
keywordsGrain boundaries
keywordsMechanisms AND Phase transition temperature
treeJournal of Engineering Materials and Technology:;1993:;volume( 115 ):;issue: 003
contenttypeFulltext


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