| contributor author | S. Hunt | |
| contributor author | L. A. Carlsson | |
| date accessioned | 2017-05-08T23:40:59Z | |
| date available | 2017-05-08T23:40:59Z | |
| date copyright | September, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26139#249_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111753 | |
| description abstract | Recently introduced overmolded pad array chip carrier (OMPAC) electronic packages sometimes suffer from debonding between the overmold material and the printed circuit board. In this study, bond strength is characterized by a combination of experimental and analytical methods. Test specimens representative for OMPAC structures were designed, manufactured, and tested to failure in tension and torsion. Finite element stress analysis of the specimens was performed in conjunction with a combined interfacial stress failure criterion to determine interfacial tensile and shear strengths from the measured failure loads. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Debonding in Overmolded Integrated Circuit Packages | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909325 | |
| journal fristpage | 249 | |
| journal lastpage | 255 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress | |
| keywords | Shear (Mechanics) | |
| keywords | Torsion | |
| keywords | Stress analysis (Engineering) | |
| keywords | Bond strength | |
| keywords | Analytical methods | |
| keywords | Finite element analysis | |
| keywords | Failure | |
| keywords | Integrated circuits | |
| keywords | Tension | |
| keywords | Printed circuit boards AND Electronic packages | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003 | |
| contenttype | Fulltext | |
