| contributor author | M. Eftychiou | |
| contributor author | T. L. Bergman | |
| contributor author | G. Y. Masada | |
| date accessioned | 2017-05-08T23:38:09Z | |
| date available | 2017-05-08T23:38:09Z | |
| date copyright | March, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26127#48_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110095 | |
| description abstract | A numerical model is developed that describes the infrared reflow soldering of surface mounted components onto prewired circuit cards. The model predicts convective conditions within the reflow oven and uses these conditions, in conjunction with a radiative heat transfer analysis and a two-dimensional transient conduction analysis, to predict the thermal response of a card assembly as its components are soldered. The model is described, and its performance is illustrated through presentation of base case simulations. Parametric simulations are performed to determine the sensitivity of the card assembly thermal response to variations in oven conditions and uncertainties in the convective, as well as radiative heat transfer portions of the model. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905441 | |
| journal fristpage | 48 | |
| journal lastpage | 54 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature effects | |
| keywords | Reflow soldering | |
| keywords | Ovens | |
| keywords | Engineering simulation | |
| keywords | Radiative heat transfer | |
| keywords | Manufacturing | |
| keywords | Heat conduction | |
| keywords | Computer simulation AND Circuits | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001 | |
| contenttype | Fulltext | |
