| contributor author | T. J. Singler | |
| contributor author | E. R. Prack | |
| contributor author | J. A. Clum | |
| date accessioned | 2017-05-08T23:38:07Z | |
| date available | 2017-05-08T23:38:07Z | |
| date copyright | June, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26129#128_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110066 | |
| description abstract | Preliminary results from solderability studies are used to elucidate the physicochemical aspects of solderability, in particular the relationship between liquid composition and wetting. Spreading front morphology is discussed and a possible mechanism for observed rapid spreading sequences is advanced. That mechanism is based on solubility of metallization in one of the solder components (Sn). A composition study of a spreading sequence exhibiting a precursor film is presented along with a discussion of the role of the film in the overall wetting process. Segregation of the Pb and Sn alloy components during the spreading is discussed in terms of surface energy concepts, and the microscopic features of the substrate. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Wetting Dynamics of Molten Solder Alloys on Metal Substrates | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2906409 | |
| journal fristpage | 128 | |
| journal lastpage | 134 | |
| identifier eissn | 1043-7398 | |
| keywords | Dynamics (Mechanics) | |
| keywords | Metals | |
| keywords | Alloys | |
| keywords | Solders | |
| keywords | Wetting (Surface science) | |
| keywords | Mechanisms | |
| keywords | Tin alloys AND Surface energy | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002 | |
| contenttype | Fulltext | |
