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contributor authorS. A. Dunn
date accessioned2017-05-08T23:37:25Z
date available2017-05-08T23:37:25Z
date copyrightSeptember, 1992
date issued1992
identifier issn0021-8936
identifier otherJAMCAV-26343#552_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/109666
description abstractMeasurement of the temperature changes which occur as a body undergoes a change in stress is becoming a widely used technique for the analysis of surface stress fields. In this paper, an investigation into the effects of thermal conduction on surface thermoelastic temperature changes for composite materials is reported. A mathematical model which shows the effects of thermal conduction is developed, and the results from this model are compared with experimental data. The mathematical model is then extended to solve for heat transfer between two thermally dissimilar materials. It is shown how this model can be used to account for the effects of a surface epoxy layer on the observed thermoelastic temperature changes.
publisherThe American Society of Mechanical Engineers (ASME)
titleAnalysis of Thermal Conduction Effects on Thermoelastic Temperature Measurements for Composite Materials
typeJournal Paper
journal volume59
journal issue3
journal titleJournal of Applied Mechanics
identifier doi10.1115/1.2893759
journal fristpage552
journal lastpage558
identifier eissn1528-9036
keywordsComposite materials
keywordsTemperature measurement
keywordsHeat conduction
keywordsTemperature
keywordsStress
keywordsEpoxy adhesives AND Heat transfer
treeJournal of Applied Mechanics:;1992:;volume( 059 ):;issue: 003
contenttypeFulltext


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