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contributor authorG. P. Peterson
date accessioned2017-05-08T23:37:17Z
date available2017-05-08T23:37:17Z
date copyrightMay, 1992
date issued1992
identifier issn0003-6900
identifier otherAMREAD-25626#175_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/109572
description abstractThe concept of a micro heat pipe was first proposed in 1984. Since that time, numerous analytical and experimental investigations have been conducted to determine the fundamental parameters that govern the operation of these devices. Micro heat pipes ranging in size from 1 mm in diameter and 60 mm in length to 30 μm in diameter and 10 mm in length have been analyzed, modelled, and fabricated. The following review describes the historical development of these devices, along with the analytical and numerical techniques used to model and predict their performance and the results of several recent experimental investigations. Because of recent advances in the development of micro heat pipes fabricated as an integral part of semiconductor wafers, particular emphasis has been placed on various construction and charging methods currently under investigation.
publisherThe American Society of Mechanical Engineers (ASME)
titleOverview of Micro Heat Pipe Research and Development
typeJournal Paper
journal volume45
journal issue5
journal titleApplied Mechanics Reviews
identifier doi10.1115/1.3119755
journal fristpage175
journal lastpage189
identifier eissn0003-6900
keywordsIndustrial research
keywordsHeat pipes
keywordsSemiconductor wafers AND Construction
treeApplied Mechanics Reviews:;1992:;volume( 045 ):;issue: 005
contenttypeFulltext


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