| contributor author | Boris Mirman | |
| date accessioned | 2017-05-08T23:32:23Z | |
| date available | 2017-05-08T23:32:23Z | |
| date copyright | June, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26116#183_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106773 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988 | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904361 | |
| journal fristpage | 183 | |
| journal lastpage | 184 | |
| identifier eissn | 1043-7398 | |
| keywords | Microelectronic packaging | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002 | |
| contenttype | Fulltext | |
