| contributor author | A. Zebib | |
| contributor author | Y. K. Wo | |
| date accessioned | 2017-05-08T23:29:46Z | |
| date available | 2017-05-08T23:29:46Z | |
| date copyright | March, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26106#41_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105272 | |
| description abstract | Thermal analysis of forced air cooling of an electronic component is modeled as a two-dimensional conjugate heat transfer problem. The velocity field in a constricted channel is first computed. Then, for a typical electronic module, the energy equation is solved with allowance for discontinuities in the thermal conductivity. Variation of the maximum temperature with the average air velocity is presented. The importance of our approach in evaluating possible benefits due to changes in component design and the limitations of the two-dimensional model are discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Two-Dimensional Conjugate Heat Transfer Model for Forced Air Cooling of an Electronic Device | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226507 | |
| journal fristpage | 41 | |
| journal lastpage | 45 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat transfer | |
| keywords | Cooling | |
| keywords | Channels (Hydraulic engineering) | |
| keywords | Thermal conductivity | |
| keywords | Clearances (Engineering) | |
| keywords | Design | |
| keywords | Electronic components | |
| keywords | Equations | |
| keywords | Thermal analysis AND Temperature | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001 | |
| contenttype | Fulltext | |
