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    Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints 

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 002:;page 49
    Author(s): Zhenfeng Guo; Hans Conrad
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An increased cooling rate following reflow produced a decrease in the microstructure size including the size of the colonies, the Pb-rich dendrites and the eutectic phases. The decrease in ...
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