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RISA Study on the Damage Layer Removal of Single-Crystal Silicon Wafer After Atmospheric-Pressure Plasma Etching
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, atmospheric-pressure (AP) plasma generated using He/O2/CF4 mixture as feed gas was used to etch the single-crystal silicon (100) wafer and the characteristics of the etched surface were investigated. The ...
Discrete Fourier Transform-Based Trajectory Decomposition for Parallel Tool Servo Diamond Turning of Microstructured Surfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Diamond turning is a mainstream technology for fabricating microstructured surfaces with high form fidelity. However, traditional systems utilizing either the slow slide servo (SSS) or fast tool servo (FTS) are ...