Abstract: Large-scale undercoolings and long incubation periods for solidification of 63Sn-37Pb solder pastes were observed through a differential scanning calorimeter, as functions of cooling rate and contact ...

Abstract: Surface mount components soldered with 58Bi–42Sn on printed circuit boards fell off after about 500 cycles of−45°C ↔ 100°C in a thermal chamber. Failure analysis revealed that the ...