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    Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 456
    Author(s): Z. A. Williams; J. A. Roux
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Much focus has been placed on the thermal management of electronics in recent years. An overall reduction in size of electronic components as well as advances in chip technology, leading to ...
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    Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 488
    Author(s): Z. A. Williams; J. A. Roux
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The increasing demand for smaller more compact electronic systems as well as the need to handle higher levels of power dissipation has lead to an increase in necessity for more innovative ...
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    DSpace software copyright © 2002-2015  DuraSpace
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian