Search
CSV
RISThermo-Mechanical Simulation Framework for Assessing Process-Induced Delamination Risks in Large-Area Fan-Out Panel-Level Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. This study develops a finite element modeling (FEM) framework for predicting interfacial fracture behavior during the debonding stage of fan-out panel-level packaging (FOPLP). Although FOPLP offers advantages ...