Abstract: Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA joints under hygrothermal ...

Abstract: Abstract. Hybrid bonding is recognized as one of the most promising technologies to meet the demand of miniaturization in future three-dimensional integrated circuits. However, the ever-shrinking of Cu pad size poses new ...

Abstract: The transferring of thin chip from donor to receptor plays a critical role in advanced electronic package, and the productivity is determined by the interfacial behavior between chip and substrate during chip transferring. ...

Abstract: The wheel-legged robot inherits the merit of both the wheeled robot and the legged robot, which can not only adapt to the complex terrain but also maintain the driving efficiency on the flat road. This article presents an ...