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    Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 004:;page 41003
    Author(s): Yi Yan; Xu Chen; Xingsheng Liu; Yunhui Mei; Guo-Quan Lu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Conduction-cooled high power laser diodes have a variety of significant commercial, industrial, and military applications. For these devices to perform effectively, an appropriate die-attached ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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