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RISWeight Functions and Stress Intensity Factors for Longitudinal Semi-Elliptical Cracks in Thick-Wall Cylinders
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Weight functions for the surface and the deepest point of an internal longitudinal semi-elliptical crack in a thick-wall cylinder (Ri /t = 1) were derived from a general weight function and ...
Research Challenges of Heat Transfer to Supercritical Fluids
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Supercritical fluids (SCFs) become more and more important in various engineering applications. In nuclear power systems, SCFs are considered as coolant of the reactor core such as the supercritical water-cooled reactor ...
A Higher-Order Theory for Plane Stress Conditions of Laminates Consisting of Isotropic Layers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a higher-order theory is derived for laminates consisting of isotropic layers, on the basis of three-dimensional elasticity with displacements as higher-order functions of z in ...
Dynamics of a Partially Full Cylinder Containing a Magnetic Liquid in a Magnetic Field
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study is concerned with the transient motion of an infinitely long thin-walled circular cylinder partially filled with a magnetic liquid under magnetic and nonmagnetic forces. Starting from ...
Cylindrical Cavity Expansion Penetration Model for Concrete Targets with Shear Dilatancy
Publisher: American Society of Civil Engineers
Abstract: A dynamic cylindrical cavity expansion model is presented herein to predict the penetration of concrete targets subjected to impact by conical-nosed projectiles at normal incidence. It is assumed that cavity expansion in ...
Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required ...
Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates ...
Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50×10−6m(50μm) deep and 200×10−6m(200μm) ...
Viscoplastic Constitutive Modeling of Anisotropic Damage Under Nonproportional Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Based on the theory of damage mechanics, a viscoplastic constitutive modeling of anisotropic damage for the prediction of forming limit curve (FLC) is developed. The model takes into account ...
Prediction of Forming Limit Diagram Based on Damage Coupled Kinematic-Isotropic Hardening Model Under Nonproportional Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Based on the theory of damage mechanics, an anisotropic damage coupled mixed isotropic-kinematic hardening plastic model for the prediction of forming limit diagram (FLD) is developed. The model ...