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RISThermal–Hydraulic Performance of Ultra-Confined Two-Phase Jet-Impingement Cooling With Distributed Inlet–Outlet Manifolds
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. This study experimentally investigates the thermal–hydraulic performance of ultraconfined two-phase jet-impingement cooling using a distributed inlet–outlet nozzle manifold, a configuration that has received ...
Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5D Silicon-Based Integration Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. In-plane thermal crosstalk is a crucial thermal management challenge, especially in silicon-based 2.5D heterogeneous integration systems, where the relatively high thermal conductivity of silicon interposers ...
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler offers lower pressure drop and increased heat removal capability (>1 kW/cm2) for microprocessors and power electronics cooling using ...
Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Two-phase jet impingement cooling is a promising solution for high-heat-flux semiconductor thermal management, as it combines strong convective heat transfer with boiling to remove large heat loads at relatively ...