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RISEstimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Particulate thermal interface materials (TIMs) are commonly used to transport heat from chip to heat sink. While high thermal conductance is achieved by large volume loadings of highly conducting particles in a compliant ...
Thermodynamic Restrictions on, and Eshelbian Forms of Interfacial Stress Under Mechanical, Thermal, and Chemical Driving Forces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. In this article, the thermodynamic configurational force and velocity associated with a reaction-diffusion moving interface are studied to derive both the Cauchy stress, its Eshelbian form, and their Piola ...