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A Material Removal Rate Prediction Model for High-Shear and Low-Pressure Grinding of Single Crystal Silicon
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel abrasive tool, based on the principle of liquid body armor, was developed in a previous study. However, a material removal rate (MRR) model for the high-shear and low-pressure grinding of brittle materials using ...
Theoretical and Experimental Investigation of Material Removal Rate in Magnetorheological Shear Thickening Polishing of Ti–6Al–4V Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Magnetorheological shear thickening polishing (MRSTP) is a novel hybrid polishing method that combines the magnetorheological effect and the shear thickening effect. It has great potential for ultra-precision machining of ...
A Material Removal Rate Prediction Model for High-Shear and Low-Pressure Grinding of Single Crystal Silicon
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel abrasive tool, based on the principle of liquid body armor, was developed in a previous study. However, a material removal rate (MRR) model for the high-shear and low-pressure grinding of brittle materials using ...
Investigating the Tribological Performance of Laser Powder Bed Fusion-Manufactured Maraging Steel Through Advanced Postprocessing Techniques
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Laser powder bed fusion (LPBF) facilitates the production of high-strength maraging steel components with intricate geometries; however, inherent surface roughness (∼6.125 µm) and suboptimal tribological performance ...
A Novel Slurry for Atomic-Scale Polishing of Potassium Dihydrogen Phosphate Crystals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Atomic-scale surfaces and structures have been playing a significant role in the next generation of devices and products. Potassium dihydrogen phosphate (KDP) crystals are crucial in energy sectors but challenging for ...
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