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RISMeasurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moiré Interferometry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moiré interferometry. One ...
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling ...