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    A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique 

    Source: Journal of Electronic Packaging:;2023:;volume( 145 ):;issue: 003:;page 31007-1
    Author(s): Doranga, Sushil; Xie, Dongji; Lee, Jeffrey; Zhang, Andy; Shi, Xue; Khaldarov, Valeriy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies ...
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    Seepage Erosion and Stability Criterion for Construction and Demolition Waste Particles in Embankment Fill Applications 

    Source: Journal of Materials in Civil Engineering:;2025:;Volume ( 037 ):;issue: 011:;page 04025422-1
    Author(s): Gao, Qian-Feng; Shi, Xue-Ke; Li, Zhongsen; Shi, Zhen-Ning; Zeng, Ling; Wang, Chu-Sheng
    Publisher: American Society of Civil Engineers
    Abstract: AbstractConstructing highway embankment is an efficient way for large-scale utilization of construction and demolition waste (CDW). This study evaluates the seepage erosion behavior of compacted CDW particles through seepage ...
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    DSpace software copyright © 2002-2015  DuraSpace
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