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Performance Evaluation of Direct Write Thermoformed Additively Printed Silver Circuits With Electrically Conductive Adhesive for in Mold Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. The development of additively printed thermoformable circuitry for in-mold electronics (IME) has garnered immense interest due to its benefits, including flexible design, cost-effectiveness, weight reduction, and ...
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