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    Structural Analyses of Spacecraft Electronic Packages 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001:;page 96
    Author(s): S. Kannappan; V. Kunukkassril
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The spacecraft electronic assemblies are subjected to severe environmental conditions during testing, launching and during orbit mission. The success of the mission depends upon the proper functioning ...
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    Effects of Grain Size and Operating Parameters on the Mechanics of Grinding 

    Source: Journal of Manufacturing Science and Engineering:;1972:;volume( 094 ):;issue: 003:;page 833
    Author(s): S. Kannappan; S. Malkin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An investigation is described of the effects of grain size and operating parameters on the mechanics of grinding. Results indicate that the specific cutting energy in grinding, which is the ...
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    Introduction to Pipe Stress Analysis 

    Source: Journal of Pressure Vessel Technology:;1988:;volume( 110 ):;issue: 003:;page 340
    Author(s): S. Kannappan; H. Saunders
    Publisher: The American Society of Mechanical Engineers (ASME)
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian