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    A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 002:;page 190
    Author(s): S. J. Russell
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A mathematical model of creep/relaxation was developed which allows non steady-state behavior, incorporates a modification of the customary steady-state stress versus creep rate power law in order ...
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