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    Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 004:;page 335
    Author(s): Reza Ghaffarian
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array ...
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    DSpace software copyright © 2002-2015  DuraSpace
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