Abstract: Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each ...

Abstract: An investigation of interconnect fatigue in photovoltaic systems has led to the development of useful reliability-design and life-prediction algorithms presented here. Experimental data gathered in ...

Abstract: Creep strain is probably the most important time-dependent damage accrual factor affecting solder joint reliability. Under typical multi-hour loading conditions, creep-induced strain is a complex ...

Abstract: With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic ...