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    Thermal–Hydraulic Performance of Ultra-Confined Two-Phase Jet-Impingement Cooling With Distributed Inlet–Outlet Manifolds 

    Source: ASME Journal of Heat and Mass Transfer:;2026:;volume( 148 ):;issue:007:;page 163
    Author(s): Yogi, Ketan; Sahu, Gopinath; Quan, Ian; Patel, Akshat; Yang, Yunchun; Wei, Tiwei
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. This study experimentally investigates the thermal–hydraulic performance of ultraconfined two-phase jet-impingement cooling using a distributed inlet–outlet nozzle manifold, a configuration that has received ...
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    Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5D Silicon-Based Integration Systems 

    Source: Journal of Electronic Packaging:;2026:;volume( 148 ):;issue:002
    Author(s): Chen, Zhengwei; Song, Yingru; Yang, Ye; Quan, Ian Xin; Marconnet, Amy M.; Wei, Tiwei
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. In-plane thermal crosstalk is a crucial thermal management challenge, especially in silicon-based 2.5D heterogeneous integration systems, where the relatively high thermal conductivity of silicon interposers ...
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