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    A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003:;page 220
    Author(s): Peter E. Jimenez; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A new type of immersion cooled module, the BTPFL-C2, was developed for thermal management of future high flux avionics while conforming to the geometrical constraints of existing military modules ...
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    Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002:;page 116
    Author(s): Issam Mudawar; Robert E. Morgan; Peter E. Jimenez
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An 820-Watt clamshell module was fabricated and tested in order to assess the feasibility of cooling future high heat flux avionic hardware via subcooled phase change. One half of the module ...
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