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Comparative Analysis Between Water-Cooled and Air-Cooled Heat Dissipation in a High-Power Light-Emitting Diode Chipset
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: With a substantial increase in thermal power density, the operating temperature of high-power light-emitting diodes (LEDs) rises rapidly, exerting a notable effect on chipsets’ performance. A water-cooled microchannel ...
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