Search
CSV
RISMicro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-mechanical deformations of microstructures in a surface laminar circuit (SLC) substrate are quantified by microscopic moiré interferometry. Two specimens are analyzed; a bare SLC substrate ...