Abstract: Coldplates are a crucial component in various cooling applications, such as cooling data center servers and power electronics. The unprecedented growth in electronics power density, along with the resulting ultrahigh heat ...

Abstract: Abstract. This study investigates flow boiling in pin-fin heat sinks, aiming to bridge the gap in the literature between microscale and macroscale geometries. The focus is on hydraulic diameters ranging from 880 μm to ...

Abstract: The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, ...