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RISInvestigation of the High-Vacuum Au/Si Eutectic Wafer Bonding Process for MEMS Resonators
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. This study demonstrates a reliable wafer-level Au/Si eutectic bonding technique suitable for hermetic packaging of MEMS resonators with small cavities (≤0.01 mm3). By optimizing the Au-Si eutectic bonding process, ...