Abstract: The objective of this study is to understand the effects of various parameters involved in the chip design and cooling on the occurrence of hot spots on a multicore processor chip. The thermal environment for the die is ...

Abstract: Since the advent of modern electronics technology, heat transfer science and engineering has served in the development of computer technology. The computer as an object of heat transfer research has a unique aspect; it ...

Abstract: Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of handheld ...

Abstract: Thermal management of very large-scale computers will have to leave the traditional well-beaten path. Up to the present time, the primary concern has been with rising heat flux on the integrated circuit chip, while a space ...

Abstract: A system of temperature calculations is developed to study the conditions leading to hot spot occurrence on multicore processor chips. The analysis is performed on a physical model which incorporates certain salient features ...