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RISHeat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the ...
Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a ...
Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The objective of this study is to understand the effects of various parameters involved in the chip design and cooling on the occurrence of hot spots on a multicore processor chip. The thermal environment for the die is ...
Heat in Computers: Applied Heat Transfer in Information Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Since the advent of modern electronics technology, heat transfer science and engineering has served in the development of computer technology. The computer as an object of heat transfer research has a unique aspect; it ...
Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three Layer Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of handheld ...
Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal management of very large-scale computers will have to leave the traditional well-beaten path. Up to the present time, the primary concern has been with rising heat flux on the integrated circuit chip, while a space ...
A Numerical Method for Solving Momentum Equations in Generalized Coordinates (Its Application to Three-Dimensional Separated Flows)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A finite difference calculation procedure has been developed for the calculations of the three-dimensional fully elliptic flows over irregular boundaries. A simple control volume analysis is ...
Non-Darcy Couette Flow in a Porous Medium Filled With an Inelastic Non-Newtonian Fluid
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Newtonian and non-Newtonian Couette flows through inelastic fluid saturated porous media due to a moving plate boundary have been investigated analytically. The momentum equation which includes ...
Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A system of temperature calculations is developed to study the conditions leading to hot spot occurrence on multicore processor chips. The analysis is performed on a physical model which incorporates certain salient features ...
Thermal Management of Electronic Equipment: A Review of Technology and Research Topics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Increasing miniaturization of microcircuits on chips of increasing size and new schemes of electrical connection, such as flip-chip bonding and surface mounting, are setting more demanding criteria ...