CSV
RISA New Accelerated Method to Characterize Degradation of Thermal Interface Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Due to advances in 3D integration and miniaturization of chips, the power density and number of hotspots within electronic packages have increased rapidly. A major bottleneck in the chip-to-coolant thermal ...
From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon on Insulator Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicononinsulator (SOI) technology has sparked advances in semiconductor and MEMs manufacturing and revolutionized our ability to study phonon transport phenomena by providing singlecrystal silicon layers with thickness ...
Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5D Silicon-Based Integration Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. In-plane thermal crosstalk is a crucial thermal management challenge, especially in silicon-based 2.5D heterogeneous integration systems, where the relatively high thermal conductivity of silicon interposers ...