Abstract: Phase change materials (PCMs) are effective at storing thermal energy and are attractive for use in electronics to smooth temperature peaks during periods of high demand; however, the use of PCMs has been somewhat limited ...

Abstract: Abstract. Due to advances in 3D integration and miniaturization of chips, the power density and number of hotspots within electronic packages have increased rapidly. A major bottleneck in the chip-to-coolant thermal ...

Abstract: Abstract. Degradation of phase change materials (PCMs) is critical in the design of thermal management systems (TMSs). Although some previous studies have explored the long-term stability of PCMs, most have performed thermal ...

Abstract: Lead users play an integral part in helping engineers to identify latent needs of customers, and this approach has been used in a variety of ways within the design community. However, despite their close resemblance to ...

Abstract: Large thermal gradients represent major operational hazards in microprocessors; hence, there is a critical need to monitor possible hot spots both accurately and in real time. Thermal monitoring in microprocessors is ...

Abstract: Ångström's method has been used to quantify thermal diffusivity of materials for over 150 years via measurement of thermal waves propagating through a long, thin sample. However, the traditional Ångström's method has some ...

Abstract: Silicononinsulator (SOI) technology has sparked advances in semiconductor and MEMs manufacturing and revolutionized our ability to study phonon transport phenomena by providing singlecrystal silicon layers with thickness ...

Abstract: Abstract. In-plane thermal crosstalk is a crucial thermal management challenge, especially in silicon-based 2.5D heterogeneous integration systems, where the relatively high thermal conductivity of silicon interposers ...