Abstract: In this paper, the finite volume method (FVM) is used for the simulation of flip chip underfill process by considering non-Newtonian flow between two parallel plates that emulate the silicon ...

Abstract: A three-dimensional numerical model is developed to simulate the mold filling behavior in the plastic encapsulation of microchips. The conventional Hele–Shaw approximation is inadequate to analyze ...

Abstract: Wing stiffness is very crucial in augmenting aerodynamic forces in flapping wing flyers. In this work, the effect of wing deformation was studied using three-dimensional numerical analysis (two-way fluid structure interaction), ...