Abstract: This paper describes mechanical means for enhancing the adhesion between the epoxy molding compound and the die and die pad in plastic packages. By introducing patterns of holes and slots along ...

Abstract: An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located ...

Abstract: The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow ...