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    Thermally Induced Failure of Microelectronic Structures 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001:;page 80
    Author(s): J. F. Cardenas-Garcia; M. C. Chyu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The purpose of this paper is to perform a theoretical evaluation to assess mechanical failure of an idealized two-dimensional, narrow, thin microelectronic structure, modelled as a plate, composed ...
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