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RISThermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The chip-size integrated double-layer microchannels (DLMCs) and multilayer microchannels (MLMCs) are investigated to optimize the thermal performance of three-dimensional integrated circuits (3D ICs). The chip-size integrated ...
Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rectangular-shaped and disk-shaped heat pipes, as innovative heat sinks, are investigated to optimize the thermal performance of three-dimensional integrated circuits (3D ICs) in this work. Finite volume numerical analysis ...