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RISReliability Based Design Guidance of Three Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the latest microelectronics industry, the emerging threedimensional (3D) chip stacking technique using through silicon via (TSV) enables higher integration density that allows greater numbers of interconnections in order ...
An Effective Approach to Solve Design Optimization Problems With Arbitrarily Distributed Uncertainties in the Original Design Space Using Ensemble of Gaussian Reliability Analyses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reliabilitybased design optimization (RBDO) algorithms have been developed to solve design optimization problems with existence of uncertainties. Traditionally, the original random design space is transformed to the standard ...
Design and Optimization of Multiple Microchannel Heat Transfer Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, two different configurations of multiple microchannel heat sinks, with fluid flow, are investigated for heat removal: straight and Ushaped channel designs. Numerical models are utilized to study the multiphysics ...
Gravity Compensation for Variable Payloads Using Slider-Guided Compression Springs
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Gravity compensation is crucial for improving the energy efficiency of robotic systems, but achieving static balancing with variable payloads remains a design challenge. This article proposes a gravity compensation ...
Multi-Objective Design Optimization of Multiple Microchannel Heat Transfer Systems Based on Multiple Prioritized Preferences
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Accelerated development in the field of electronics and integrated circuit technology further pushed the need for better heat dissipating devices with reduced component dimensions. In the design optimization of microchannel ...
User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Tremendous efforts had been given to ensure proper heat dissipation in electronics cooling but very seldom consider design robustness and user preferences in design principles of the heat-dissipating devices. Multi-objective ...
Reliability-Based Analysis and Optimization of the Gravity Balancing Performance of Spring-Articulated Serial Robots With Uncertainties
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This article proposes a method for analyzing the gravity balancing reliability of spring-articulated serial robots with uncertainties. Gravity balancing reliability is defined as the probability that the torque reduction ...
Learning Johnson–Cook Parameters From Chip Formation and Cutting Forces Using a Multimodal Machine Learning Framework
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. The Johnson–Cook (J–C) plasticity and damage models are widely used for simulating machining processes under large strains, high strain rates, and high temperatures. However, determining the J–C parameters (A, ...