Abstract: Abstract. The polyimide (PI)/silicon (Si) is a critical interface in 2.5D packaging and is highly susceptible to failure due to thermal and mechanical loads. The large thermal expansion mismatch that exists between these ...

Abstract: Abstract. As integration density and performance demands continue to rise in modern radio frequency (RF) systems, system-in-package (SiP) architectures face growing challenges in managing both electromagnetic interference ...

Abstract: There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full-wave three-dimensional (3D) model ...