Abstract: Leadfree solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz highfrequency ...

Abstract: Kinks have a strong influence on the structural performance of wire bonds. In this study, a variablelength linkspring model has been developed to better understand kink formation. In this model, a gold wire was decomposed ...

Abstract: Aggregate occupies at least three-quarters of the volume of asphalt mixture and can significantly affect the performance of pavement. The geometrical morphology influences the slippage and interlock among aggregates for ...

Abstract: Silicon piezoresistive pressure sensors can only operate below 125 °C due to the leakage current of the PN junction. However, silicon-on-insulator (SOI) high-temperature pressure sensors use SiO2 for total dielectric ...

Abstract: With the increasing interconnect density of electronic components, copper–copper direct bonding technology has garnered increasing attention from researchers. The electroplating bonding method is an efficient copper pillar ...

Abstract: AbstractIn response to the development of “sponge cities,” permeable pavements have been increasingly used in road construction to eliminate the adverse effects caused by traditional pavements. In recent years, permeable ...

Abstract: Abstract. Temperature control of samples constitutes a critical aspect in magnetron sputtering processes. Poor surface temperature uniformity can lead to film warping and delamination, ultimately reducing chip production ...

Abstract: With the development of packaging devices toward high performance and high density, electronic devices are subjected to thermo-electric stresses under service conditions, which has become a particularly important reliability ...