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    Statistical Characteristics of Fatigue Failure of Copper Thin Films 

    Source: Journal of Engineering Materials and Technology:;2013:;volume( 135 ):;issue: 004:;page 41007
    Author(s): Jang, Jae; Hwangbo, Yun; Kim, Jae; Lee, Hak; Mag; Lee, Soon
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Tension–tension fatigue tests were conducted on an electrodeposited copper film with a thickness of 12 خ¼m under four levels of maximum stress and two levels of mean stress. Statistical characteristics of the measured ...
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    Synthesis and Heat Transfer Performance of Phase Change Microcapsule Enhanced Thermal Fluids 

    Source: Journal of Heat Transfer:;2015:;volume( 137 ):;issue: 009:;page 91018
    Author(s): Cao, Fangyu; Kalinowski, Paul; Lawler, John; Seung Lee, Hak; Yang, Bao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Polyalphaolefins (PAOs) are widely implemented for electronics cooling, but suffer from a low thermal conductivity of about 0.14 W/mK. However, adding thermally conductive, phasechangematerial (PCM) particles to a PAO ...
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    Topology Optimization of Three-Dimensional Woven Materials Using a Ground Structure Design Variable Representation 

    Source: Journal of Mechanical Design:;2019:;volume( 141 ):;issue: 006:;page 61403
    Author(s): Ha, Seung-Hyun; Lee, Hak Yong; Hemker, Kevin J.; Guest, James K.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Three-dimensional (3D) weaving has recently arisen as viable means for manufacturing metallic, architected microlattices. Herein, we describe a topology optimization approach for designing the architecture of such 3D woven ...
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