YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-5 of 5

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 001:;page 14501
    Author(s): Ladani, Leila; Abdelhadi, Ousama
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a leadfree Sn3.5Ag/Cusubstrate soldering system are investigated in different sized joints using nanoindentation. The specimens were ...
    Request PDF

    Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004:;page 41003
    Author(s): Choudhury, Soud Farhan; Ladani, Leila
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Currently, intermetallics (IMCs) in the solder joint are getting much attention due to their higher volume fraction in the smaller thickness interconnects. They possess different mechanical properties compared to bulk ...
    Request PDF

    Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid Liquid Interdiffusion Sn3.5Ag/Cu Substrate Solder Joints 

    Source: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 002:;page 21004
    Author(s): Abdelhadi, Ousama M.; Ladani, Leila
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effect of joint size on the interfacial reaction in the Sn3.5Ag/Cusubstrate soldering system was examined. An experiment was conducted in which parameters such as bonding time, temperature, and pressure were varied at ...
    Request PDF

    Mechanical Anisotropy and Strain Rate Dependency Behavior of Ti6Al4V Produced Using E Beam Additive Fabrication 

    Source: Journal of Engineering Materials and Technology:;2014:;volume( 136 ):;issue: 003:;page 31006
    Author(s): Ladani, Leila; Razmi, Jafar; Farhan Choudhury, Soud
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Anisotropic mechanical behavior is an inherent characteristic of parts produced using additive manufacturing (AM) techniques in which parts are built layer by layer. It is expected that inplane and outofplane properties ...
    Request PDF

    Mechanical Behavior of Electron Beam Powder Bed Fusion Additively Manufactured Ti6Al4V Parts at Elevated Temperatures 

    Source: Journal of Manufacturing Science and Engineering:;2020:;volume( 143 ):;issue: 002:;page 021013-1
    Author(s): Mian, Md Jamal; Razmi, Jafar; Ladani, Leila
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Ti6Al4V is one of the vital metal alloys used in various industries including aerospace, especially at high-temperature applications, because of having high strength-to-weight ratio, and high melting temperature. Manufacturing ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian